PCB board has developed from single layer to multi-layer, and still maintains their own development trend. With the development of high precision, high density and high reliability, PCB will remain strong vitality in the future development of electronic equipment because of its shrinking volume, reducing cost and improving performance. After using PCB for electronic equipment, because of the consistency of the same kind of PCB, the error of manual wiring is avoided, and the electronic components can be automatically inserted or mounted, soldered and inspected, which ensures the quality of electronic equipment, improves labor productivity, reduces costs and facilitates maintenance.

 

 

PCB board material:

 

 

22F single-sided composite substrate: single-sided half-glass fiber sheet. (Die punching is generally possible, if the requirements are high, computer drilling)

 

 

CEM-1 Single Side Composite Substrate: This material requires CNC drilling. (Die punching is generally possible, if the requirements are high, computer drilling)

 

 

CEM-3 double-sided composite substrate: the lowest low-end double-panel material, belongs to the semi-glass fiber material. (Except for double-sided cardboard, it belongs to the lowest material of double-sided panel. Simple double-sided panel can use this material, which is about 5-10 yuan cheaper than FR-4.

 

 

FR-4 Epoxy Glass Fiberboard: The most commonly used PCB glass fiber material.

 

 

PCB板防火等级划分：按照UL标准规定的基板燃烧特性可从高到低分为下面四类：UL-94V0、UL-94V1、UL-94V2、UL-94HB。

 

 

Semi-curable sheet: Used for making multi-layer PCB board, the commonly used models are 1080, 2116, 7628 and other specifications.

 

 

94HB cardboard: The most common cardboard materials, are basically used to make low-grade single panel, cheap. Because it has no flame retardant effect, it can not be used for a series of products with fire protection requirements such as power supply.

 

 

94V0 cardboard: cardboard material with flame retardant effect, compared with 94HB cardboard material, its composition is added with flame retardant. (die punching)

 

 

The development trend of PCB manufacturing technology at home and abroad is basically the same, that is, high density, high precision, fine aperture, fine wire, fine spacing, high reliability, multi-layer, high-speed transmission, light weight and thin type. At the same time, it will improve productivity, reduce costs, reduce pollution, and adapt to multi-species and small batch production. 。 The technical development level of printed circuit board is generally represented by line width, aperture and thickness/aperture ratio of printed circuit board.